{"id":627129,"date":"2010-01-26T02:00:00","date_gmt":"2010-01-26T07:00:00","guid":{"rendered":"http:\/\/news.directindustry.com\/press\/set\/fc300-the-high-force-and-high-accuracy-die-bonder-for-large-devices-57477-337421.html"},"modified":"2010-01-26T02:00:00","modified_gmt":"2010-01-26T07:00:00","slug":"fc300-the-high-force-and-high-accuracy-die-bonder-for-large-devices","status":"publish","type":"post","link":"https:\/\/mereja.com\/index\/627129","title":{"rendered":"FC300: The High Force and High Accuracy Die Bonder for Large Devices"},"content":{"rendered":"<p>The FC300 High Force Die \/ Flip Chip Bonder is a new generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafer up to 300 mm. It features also Nanoimprinting Lithography (NIL) capabilities.<\/p>\n<p>With a quick process head reconfiguration, the FC300 platform performs multiple applications including:<br \/>\n&#8211; High Force, particularly interesting for Cu-Cu bonding as used in 3D-IC packaging, or Nanoimprinting using a Hot Embossing Lithography process.<br \/>\n&#8211; Low Force Reflow Bonding for imaging devices, RF, or Optoelectronics assembly.<br \/>\n&#8211; UV-Curing for a Adhesive Bonding or for Nanoimprinting using a UV-NIL process.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>The FC300 High Force Die \/ Flip Chip Bonder is a new generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafer up to 300 mm. It features also Nanoimprinting Lithography (NIL) capabilities. With a quick process head reconfiguration, the FC300 platform performs multiple applications including: &#8211; High Force, particularly [&hellip;]<\/p>\n","protected":false},"author":288,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"advanced_seo_description":"","jetpack_seo_html_title":"","jetpack_seo_noindex":false,"_jetpack_memberships_contains_paid_content":false,"footnotes":""},"categories":[4821],"tags":[],"class_list":["post-627129","post","type-post","status-publish","format-standard","hentry","category-news"],"jetpack_featured_media_url":"","jetpack_shortlink":"https:\/\/wp.me\/p9NivD-2D8Z","jetpack_sharing_enabled":true,"_links":{"self":[{"href":"https:\/\/mereja.com\/index\/wp-json\/wp\/v2\/posts\/627129","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/mereja.com\/index\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/mereja.com\/index\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/mereja.com\/index\/wp-json\/wp\/v2\/users\/288"}],"replies":[{"embeddable":true,"href":"https:\/\/mereja.com\/index\/wp-json\/wp\/v2\/comments?post=627129"}],"version-history":[{"count":0,"href":"https:\/\/mereja.com\/index\/wp-json\/wp\/v2\/posts\/627129\/revisions"}],"wp:attachment":[{"href":"https:\/\/mereja.com\/index\/wp-json\/wp\/v2\/media?parent=627129"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/mereja.com\/index\/wp-json\/wp\/v2\/categories?post=627129"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/mereja.com\/index\/wp-json\/wp\/v2\/tags?post=627129"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}